為什么在Precitech和Micro-LAM允許金剛石車削的情況下選擇碳化鎢磨削？
與傳統(tǒng)的磨削方法相比，金剛石車削具有眾多優(yōu)點(diǎn)。

憑借高達(dá)每分鐘6毫米的進(jìn)料速度，我們標(biāo)準(zhǔn)測(cè)試部件的表面加工可在不到一分鐘的時(shí)間內(nèi)完成。此外，金剛石車削是一種決定性過(guò)程，可使用成熟的技術(shù)快速制造甚至復(fù)雜的衍射（相息圖）模具。

Nanform Xtc能夠生產(chǎn)5 nm Sa和150 nm PV以下的表面。與傳統(tǒng)磨削相比，工件后拋光最短可以在幾分鐘而不是幾小時(shí)內(nèi)完成。還證明對(duì)紅外（IR）材料有效：硅（Si）、硫化鋅（ZnS）、氟化鈣（CaF2）、鍺（Ge）和硒化鋅（ZnSe）。正在開(kāi)發(fā)的其他材料：碳化硅（SiC）、藍(lán)寶石、玻璃（BK7）。

Why grind tungsten carbide when Precitech and Micro-LAM enable you to diamond turn it?
Diamond turning has many advantages over the conventional grinding method.

With demonstrated feed rates up to 6 mm per minute, the finishing of our standard test part takes less than a minute. Additionally, diamond turning is a deterministic process and well-known techniques can be used to quickly manufacture even complex diffractive (kinoform) molds.

The Nanform Xtc is capable of generating surfaces under 5 nm Sa and 150 nm PV. Compared to traditional grinding, a part requiring minimum post polishing can be made in minutes instead of hours. Also demonstrated to be effective on infrared (IR) materials: Silicon (Si), Zinc Sulfide (ZnS), Calcium Fluoride (CaF2), Germanium (Ge), and Zinc Selenide (ZnSe). Other materials under development: Silicon Carbide (SiC), Sapphire, Glass (BK7).

Test Part Details

• 20 mm dia. CX fused silica
• Speed: 1000 RPM
• Feed rate: 1 µm/rev
• DoC: 2 µm
• Laser power: 10 W